- All sections
- H - Electricity
- H01S - Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light; devices using stimulated emission of electromagnetic radiation in wave ranges other than optical
- H01S 5/0234 - Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
Patent holdings for IPC class H01S 5/0234
Total number of patents in this class: 133
10-year publication summary
0
|
1
|
0
|
3
|
6
|
28
|
29
|
34
|
26
|
10
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Marvell Asia PTE, Ltd. | 6841 |
12 |
Kyocera Sld Laser, Inc. | 281 |
12 |
OSRAM OLED GmbH | 1841 |
9 |
Sony Semiconductor Solutions Corporation | 8770 |
9 |
Nuvoton Technology Corporation Japan | 420 |
7 |
Ams-osram International GmbH | 466 |
7 |
Apple Inc. | 50209 |
4 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
4 |
Mitsubishi Electric Corporation | 43934 |
4 |
OSRAM Opto Semiconductors GmbH | 3390 |
4 |
Shenzhen Raysees AI Technology Co., Ltd. | 13 |
4 |
Intel Corporation | 45621 |
3 |
Hamamatsu Photonics K.K. | 4161 |
3 |
II-VI Delaware, Inc. | 1720 |
3 |
Lumentum Operations LLC | 696 |
3 |
Panasonic Holdings Corporation | 1325 |
3 |
Patent Safe, Inc. | 7 |
3 |
Kyocera Corporation | 12735 |
2 |
The Furukawa Electric Co., Ltd. | 3486 |
2 |
SemiNex Corporation | 14 |
2 |
Other owners | 33 |